专利名称：Polyamide composition and the use发明人：Moriwaki, Takeshi, Kishimoto Sangyo Co.,
Ltd.
申请号：EP93116209.3申请日：19931007公开号：EP0592941A2公开日：19940420
摘要：Polyamide composition comprising 70-95 weight % of aliphatic polyamide, 5-30weight % of phenolic resin, and 0-20 % of semi-aromatic amorphous polyamide, andfurther high density polyamide composition comprising 100 parts by weight of themixture of 60-95 parts by weight of aliphatic crystalline polyamide, 5-30 parts by weightof phenolic resin, and 200-1000 parts by weight of metal powder or metal oxide powderor inorganic filler having specific gravity of more than 2.6.
申请人：KISHIMOTO SANGYO CO., LTD.
地址：3-7, Fushimimachi 3-chome, Chuo-ku Osaka-shi, Osaka JP
国籍：JP
代理机构：Türk, Gille, Hrabal, Leifert
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