TOSHIBA Photocoupler GaAℓAs IRed & Photo−IC
TLP115
High Speed, Long Distance Isolated Line Receiver
Microprocessor System Interfaces
Digital Isolation For A / D, D / A Conversion Computer−Peripheral Interfaces Ground Loop Elimination
The TOSHIBA mini flat coupler TLP115 is small outline coupler, suitable for surface mount assembly.
TLP115 consists of a GaAℓAs light emitting diode, optically coupled to an integrated high gain, high speed shielded photo detector whose output is an open collector schottky clamped transistor.
The shield, which shunts capacitively coupled common noise to ground, provides a guaranteed transient immunity specification of 1000V / µs.
· Input current thresholds: IF=10mA (max.) · Switching speed: 10MBd (typ.)
· Common mode transient immunity: ±1000V / µs (min.) · Guaranteed performance over temp.: 0~70°C · Isolation voltage: 2500Vrms (min.) · UL recognized: UL1577, file no. E67349
Unit in mm
TOSHIBA 11−4C2 Weight: 0.09 g
Schematic
IF 1 IO VF
5VO ICC VCC 6Pin Configuration(top view)
1
VCC5
3
GND
GND46
3Shield 4
Note. A 0.1µF bypass capacitor must be connected
between pins 4 and 6.
1 : Anode 3 : Cathode 4 : GND
5 : VO(Output) 6 : VCC
Truth Table(positive logic)
Input Output H L L H
12002-09-25 TLP115
Maximum Ratings (Ta = 25°C)
Characteristic SymbolForward current LED Pulse forward current
(Note 1)
IF IFP
Rating Unit 20 mA 40 mA Peak transient forward current
IFPT 1 A (Note 2) Reverse voltage Output current
VR IO VO VCC Po Topr Tstg Tsol
Note 4)
BVS
5 V 25 mA 7 V 7 V 40 mW -40~85 °C -55~125 °C 260 °C 2500 VrmsDetector Output voltage Supply voltage
(1 minute maximum) Output power dissipation
Operating temperature range Storage temperature range Lead solder temperature(10s) Isolation voltage
(AC, 1min., RH ≤ 60%,
(Note 1) 50% duty cycle, 1ms pulse width. (Note 2) Pulse width ≤ 1µs, 300pps.
Recommended Operating Conditions
Characteristic Symbol Min. Typ. Max. Unit Input voltage, low level Input current, high level Supply voltage
Fan out
(TTL load, each channel) Operating temperature
VFL
-3 0 1.0 V IFH 13 16 20 mA VCC 4.5 5 5.5 V N
―
― 8 ―
Topr 0 ― 70 °C 2
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Electrical Characteristics
(unless otherwise specified, Ta = 0~70°C, VCC = 4.5~5.5V, VFL ≤ 1.0V)
Characteristic Symbol Test Condition Min. Typ.*Max. Unit Forward voltage Forward voltage
temperature coefficient Reverse current Capacitance between terminals
High level output current Low level output voltage “H level output→ L level output\" input current High level supply current Low level supply current Input-output
insulation leakage current Isolation resistance Stray capacitance
between input to output
VF VF / Ta IR CT IOH VOL IFH ICCH
IF=10mA, Ta=25°C IF=10mA VR=5V, Ta=25°C VF=0, f=1MHz, Ta=25°C VF=1.0, VO=5.5V
VF=1.0, VO=5.5V, Ta=25°C IF=10mA
IOL=13mA(sinking) IOL=13mA(sinking) VOL=0.6V VCC=5.5V, IF=0
― 1.65 1.80 V ― ―
-2
―
mV / °C
― 10 µA ― 45 ― pF ―
― 250 µA
― 0.5 10 ― 0.4 0.6 V ―
― 10 mA ― 7 15 mA ― 12 18 mA ― 100 µA 10
14
I=VCC=5.5V, IF=16mA CCL
VS=3540V, t=5s =IS ―
Ta25°C (Note 4)
=10R.H.≤ 60%, VS=500V DC
5×10RS
Ta25°C (Note 4)CS
― Ω
VS=0, f=1MHz
― 0.8 ― pF Ta25°C (Note 4)
* All typical values are VCC=5V, Ta=25°C
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Switching Characteristics(VCC = 5V, Ta = 25°C)
TestCir-Characteristic Symbol cuit
Propagation delay time (H→L)
Propagation delay time (L→H)
Output rise fall time (10-90%)
Common mode transient immunity at high output level
Common mode transient immunity at low output level
Test Condition
Min.
Typ.
Max.
Unit
IF=0→ 16mA
tpHL 1 CL=15pF, RL=350Ω IF=16→ 0mA
tpLH 1 CL=15pF, RL=350Ω RL=350Ω, CL=15pF
tr, tf 2 IF=016mA IF=0mA, VCM=400Vp-p
CMH 2 VO(min)=2V, RL=350Ω IF=16mA, VCM=400Vp-p
CML 2 VO(max)=0.8V,
RL=350Ω
― 60 120 ns ― 60 120 ns ― 30 ― ns
1000 ― ― V / µs
-1000 ― ― V / µs
(Note 4) Device considered a two-terminal device: Pins 1 and 3 shorted together, and pins 4, 5 and 6 shorted
together. (Note 5) The VCC supply voltage to each TLP115 isolator must be bypassed by 0.1µF capacitor. This can be either a
ceramic or solid tantalum capacitor with good high frequency characterstic and should be connected as close as possible to package VCC and GND pins of each device. (Note 6) Maximum electrostatic discharge voltage for any pins: 180V(C=200pF, R=0)
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Test Circuit 1: Switching Time Test Circuit
CL is approximately 15pF which includes probe and stray wiring capacitance. 0.1μF 350Ω IFPulse input PW = 100μs Duty ratio = 1 / 10 IF monitor
VCC VCC = 5VIFVO
CL100Ω GND Output monitor VOtpHL tpLH tftr 16mA8mA0mA5V4.5V
1.5V0.5VVOLTest Circuit 2: Common Mode Transient Immunity Test Circuit
CMH=
320(V)320(V)
, CML=
tr(ms)tf(ms)
0.1μF 350Ω IF VCC 5V
VCMVC
CLOutput monitor VO(IF= 0mA)tr90% 10% tf 400V 0V GND VCM Pulse generator ZO = 50Ω
5V 2V 0.8V VO
(IF= 10mA)VOL CL is approximately 15pF which includes probe and stray wiring capacitance.
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IF – VF
Forward voltage temperature coefficient ΔVF / ΔTa (mV / °C ) 100- 4.0
ΔVF / ΔTa – IF
Forward current IF (mA) 10- 3.20 - 25°C -2.425 - 70°C -1.61Ta = 70°C 0.125°C 0°C 0.011
1.2
1.4 1.6
1.8
2.0 - 0.80.1
0.3 1 0.5 3
5 10 30
Forward voltage VF (V)
Forward current IF (mA)
VO – IF
1010VCC = 5V Ta = 25°C 5 IOH - Ta
VF = 1V VCC = 5.5V VO = 5.5V Output voltage VO (V) High level output current IOH (µA) 836RL = 350Ω 41kΩ4kΩ210.50.30.100
0.052
4
10 6 8
- 20
0
20 40 60 80
Forward current IF (mA)
Ambient temperature Ta (°C)
VO – IF
100.50
VO L – Ta
Low level output voltage VOL (V) IF = 10mA VCC = 5.5V 0.45VCC = 5V RL = 350Ω RL = 4kΩ Output voltage VO (V) 86Ta = 70°C 4Ta = 0°C 0.40IOL = 16mA 12.8mA 0.359.6mA 6.4mA 20.3000
2 4 8 6 10 - 20 0 20 40 60 80
Forward current IF (mA) Ambient temperature Ta (°C)
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tpHL, tpLH － IF
Propagation delay time tpHL, tpLH (ns) 120RL = 4kΩ300
tr, tf – Ta
Rise， fall time tr, tf (ns) RL = 4kΩ 260LF = 16mA VCC = 5V 220 tf 100801kΩ350Ω60 tr 120RL = 350Ω 1kΩ 4kΩ 1kΩ 8040RL = 350Ω 1kΩ 4kΩ Ta = 25°C VCC = 5V tpHL 40350Ω tpLH 18
2010
012
14
16
20
- 20
0
20
40
60
80
Forward current IF (mA)
tpHL, tpLH － Ta
120RL = 4kΩAmbient temperature Ta (°C)
Propagation delay time tpHL, tpLH (ns) 100801kΩ350Ω6040RL = 350Ω 1kΩ 4kΩ IF = 16mA VCC = 5V tpHL 20 tpLH 0- 20
0
20
40
60 80
Ambient temperature Ta (°C)
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2002-09-25 TLP115
RESTRICTIONS ON PRODUCT USE
000707EBC
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. · The products described in this document are subject to the foreign exchange and foreign trade laws.
· The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice.
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