Printed circuit board structure

专利名称：Printed circuit board structure发明人：Hsien-Chieh Lin申请号：US12646904申请日：20091223公开号：US08243464B2公开日：20120814

专利附图：

摘要：Disclosed is a printed circuit board structure which is manufactured by providinga core board, forming an inner circuit layer on the core board surface, forming a bondingpad on the inner circuit, forming a ring-shaped anti-etching layer on the bonding pad,forming an anti-soldering insulation layer on the ring-shaped anti-etching layer and the

bonding pad, and forming an opening to expose a part of the bonding pad, wherein theradius of the opening is shorter than the radius of the ring-shaped anti-etching layer, andthe bonding pad surface is free of concave. The described structure may prevent thesolder extending along the bottom void of the anti-soldering insulation layer to otherregions.

申请人：Hsien-Chieh Lin

地址：Taoyuan TW

国籍：TW

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