专利名称:Package Structure
发明人:Kuo-Yang Sun,Chia-Ming Yang申请号:US10711794申请日:20041006公开号:US07115978B2公开日:20061003
专利附图:
摘要:A package structure includes a lead frame having a plurality of leads, each ofwhich includes a first recession, at least a first device, and a plurality of solder jointsrespectively positioned in the first recessions for connecting the first device to the leadframe.
申请人:Kuo-Yang Sun,Chia-Ming Yang
地址:Kao-Hsiung TW,Tai-Nan TW
国籍:TW,TW
代理人:Winston Hsu
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