专利名称：Package Structure
发明人：Kuo-Yang Sun,Chia-Ming Yang申请号：US10711794申请日：20041006公开号：US07115978B2公开日：20061003
专利附图：
摘要：A package structure includes a lead frame having a plurality of leads, each ofwhich includes a first recession, at least a first device, and a plurality of solder jointsrespectively positioned in the first recessions for connecting the first device to the leadframe.
申请人：Kuo-Yang Sun,Chia-Ming Yang
地址：Kao-Hsiung TW,Tai-Nan TW
国籍：TW,TW
代理人：Winston Hsu
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