专利名称：Adhesives, adhesive layers for electroless
plating and printed circuit boards
发明人：Dong D. Wang,Motoo Asai申请号：US08/243172申请日：19940516公开号：US05519177A公开日：19960521
摘要：An adhesive usable for electroless plating in the formation of printed circuitboards is formed by dispersing a cured heat-resistant resin powder soluble in an acid oran oxidizing agent into an uncured heat- resistant resin matrix hardly soluble in an acid oran oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is amixture of a thermoplastic resin and an uncured thermosetting resin or an uncuredphotosensitive resin.
申请人：IBIDEN CO., LTD.
代理机构：Greenblum & Bernstein
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