专利名称：WAFER
发明人：STOPPER, Herbert,PERKINS, Cornelius,
Churchill
申请号：EP85900508.0申请日：19840912公开号：EP0155965A1公开日：19851002
摘要： Wafer (1) on which is formed a layer of a thin film as an interconnect system (3)with contact sites (2, 7) between the interconnect system (3) and of binding sites (2) of thewafer (1) to form a monolithic wafer. The interconnect system (3) has binding sites on thewafer surface (1) on which chips are bonded to form a hybrid monolithic wafer system.
申请人：MOSAIC SYSTEMS, INC.
地址：1497 Maple Lane Troy, MI 48084 US
国籍：US
代理机构：Kirby, Harold Douglas Benson, et al
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