专利名称：Suspension board with circuit and producing
method thereof
发明人：Yuu Sugimoto申请号：US13317599申请日：20111024
公开号：US20120113547A1公开日：20120510
专利附图：
摘要：A suspension board with circuit includes a metal supporting board; an insulatinglayer formed on the metal supporting board having an opening penetrating in thethickness direction formed therein; and a conductive pattern formed on the insulating
layer including an external-side terminal electrically connected to an external board. Theexternal-side terminal is filled in the opening of the insulating layer. In the metalsupporting board, a support terminal electrically insulated from the surrounding metalsupporting board and electrically connected to the external-side terminal is provided.The suspension board with circuit includes a metal plating layer formed below thesupport terminal and an electrically-conductive layer interposed between the supportterminal and the metal plating layer having a thickness of 10 nm or more to 200 nm orless.
申请人：Yuu Sugimoto
地址：Osaka JP
国籍：JP
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容