专利名称:Electronic module and power supply device发明人:吉岡 拓也,高柳 雄一申请号:JP2019502810申请日:20180313
公开号:JPWO2019175950A1公开日:20200416
专利附图:
摘要:Board andA first conductor layer extending in the first direction on the topsurface of the substrateA second conductor layer which is connected to the first
conductor layer and extends over the first conductor layer in a second direction differentfrom the first direction;An electronic device disposed on the substrate and at a positiondifferent from the first conductor layer and the second conductor layerA terminalprovided on said first conductive layerAndThe first conductive layer isThe first conductivelayer isAs a current path of current flowing between said electronic device and its
terminalThe electronic device is connected to the electronic device at a position awayfrom the terminal in the first direction.
申请人:新電元工業株式会社
地址:東京都千代田区大手町2丁目2番1号
国籍:JP
代理人:大野 聖二,大野 浩之,酒谷 誠一
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