ADHESIVE SHEET AND METHOD OF MANUFACTURING ELECTRO

专利名称：ADHESIVE SHEET AND METHOD OF

MANUFACTURING ELECTRONICCOMPONENT

发明人：Tomoya TSUKUI,Gosuke NAKAJIMA申请号：US15326195申请日：20150706

公开号：US20170200629A1公开日：20170713

摘要：An adhesive sheet is provided that is capable of inhibiting scraping up of anadhesive in the dicing step, does not cause chip detachment during dicing processing,facilitates picking up, and does not readily develop adhesive transfer. According to thepresent invention, an adhesive sheet is provided that comprises a substrate film and anadhesive layer laminated on the film, wherein the adhesive layer contains 100 parts bymass of a (meth)acrylate copolymer, from 5 to 250 parts by mass of a

photopolymerizable compound, from 20 to 160 parts by mass of a softener, from 0.1 to30 parts by mass of a curing agent, and from 0.1 to 20 parts by mass of a

photopolymerization initiator, and the photopolymerizable compound has a weightaverage molecular weight from 40,000 to 220,000.

申请人：Denka Company Limited

地址：Tokyo JP

国籍：JP

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