WAFER PROCESSING APPARATUS WITH WAFER ALIGNMENT DE

专利名称：WAFER PROCESSING APPARATUS WITH

WAFER ALIGNMENT DEVICE

发明人：Masahiro Takizawa,Masaei Suwada,Masayuki

Akagawa

申请号：US12062419申请日：20080403

公开号：US20090252580A1公开日：20091008

专利附图：

摘要：A semiconductor-processing apparatus includes: a wafer handling chamber; awafer processing chamber; a wafer handling device; a first photosensor disposed in the

wafer handling chamber in front of the wafer processing chamber at a position where thewafer partially blocks light received by the first photosensor at a ready-to-load positionand substantially entirely blocks light received by the first photosensor when the wafermoves from the ready-to-load position toward the wafer processing chamber in the x-axis direction; and a second photosensor disposed in the wafer handling chamber in frontof the wafer processing chamber at a position where the wafer does not block lightreceived by the second photosensor at the ready-to-load position and partially blockslight received by the second photosensor when the wafer moves from the ready-to-loadposition toward the wafer processing chamber in the x-axis direction.

申请人：Masahiro Takizawa,Masaei Suwada,Masayuki Akagawa

地址：Tokyo JP,Tokyo JP,Tokyo JP

国籍：JP,JP,JP

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