LED package, method for making the LED package and

专利名称：LED package, method for making the LED

package and light source having the same

发明人：Shiun-Wei Chan,Chih-Hsun Ke,Chao-Hsiung

Chang

申请号：US13286084申请日：20111031公开号：US08716744B2公开日：20140506

专利附图：

摘要：An LED package includes a light transmissive encapsulation, an LED die, afluorescent layer, a baffle wall, a positive electrode and a negative electrode. The

encapsulation includes a light emitting surface and a bottom surface opposite to thelight emitting surface. The LED die, the fluorescent layer and the baffle wall areembedded in the encapsulation from the bottom surface side. The LED die includes afront surface for outputting light outward and a back surface opposite to the frontsurface. The front surface faces the light emitting surface of the encapsulation, and theback surface is exposed outside. The fluorescent layer is formed on the front surface ofthe LED die. The baffle wall surrounds the LED die and the fluorescent layer. The positiveelectrode and negative electrode are electrically connected to the LED die.

申请人：Shiun-Wei Chan,Chih-Hsun Ke,Chao-Hsiung Chang

地址：Hsinchu TW,Hsinchu TW,Hsinchu County TW

国籍：TW,TW,TW

代理机构：Novak Druce Connolly Bove + Quigg LLP

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