ELECTRONIC CIRCUIT PACKAGE ASSEMBLY AND METHOD OF

专利名称：ELECTRONIC CIRCUIT PACKAGE ASSEMBLY

AND METHOD OF PRODUCING THE SAME

发明人：KOETSU TAMURA申请号：US08897428申请日：19970721

公开号：US20010014016A1公开日：20010816

摘要：An electronic circuit package assembly of the present invention and

implemented by a TAB (Tape Automated Bonding) system includes a sheet formed ofthermosetting resin. The sheet intervenes between a substrate and an organic insulatingfilm carrying an LSI (Large Scale Integrated circuit) chip thereon. Solder is buried in thesheet beforehand. The assembly is heated to cause the solder to melt and connect wiringelectrodes formed on the substrate and outer leads provided on the organic insulatingfilm. The assembly has high reliability as to connection using solder and migration.

申请人：TAMURA KOETSU

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