专利名称：Radiation curable resin composition发明人：MASAKATSU UKON,TOSHIHIKO
TAKAHASHI,TAKASHI UKACHI
申请号：AU3361097申请日：19970707公开号：AU717118B2公开日：20000316
摘要：A radiation curable composition comprising, (A) at least one compound
containing a (meth)acrylate group represented by the following formula (1), wherein R1 isa hydrogen atom or a methyl group, R2 is an alkylene group or a hydroxyalkylene grouphaving 2 to 6 carbon atoms, R3 is a divalent organic group, n is a number of 1 to 10, m isan integer of 0 or 1, and Ar1 and Ar2 are independently a group comprising an aromaticring (B) at least one compound derived from trishydroxyethyl isocyanurate, andcontaining at least one (meth)acrylate group, and (C) at least one radiationpolymerization initiator. The radiation curable resin composition affords a high
productivity, exhibits high transparency, and produces molded articles exhibiting minimalcoloration upon exposure to light, superior dimensional precision, high heat resistance,only slight adhesion to substrates under high temperature conditions. The composition isvery useful for manufacturing molding articles.
申请人：DSM N.V.,JSR CORPORATION,JAPAN FINE COATINGS CO., LTD.
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