专利名称:Process for manufacturing a substrate and
associated substrate
发明人:Olivier Rayssac,Fabrice Letertre申请号:US10972158申请日:20041022公开号:US07041577B2公开日:20060509
专利附图:
摘要:A process for producing a substrate is described. The process includesproviding an assembly having a first layer weakly bonded to a temporary support at aninterface therebetween. At least a portion of the first layer is selectively etched
substantially to the interface to create an etched zone. A second layer is then bonded toun-etched portions of the first layer to cover the etched zone and to form a closedcavity. The first layer is detached from the temporary support at the weak bond byproviding a raised pressure in the cavity.
申请人:Olivier Rayssac,Fabrice Letertre
地址:Grenoble FR,Grenoble FR
国籍:FR,FR
代理机构:Winston & Strawn LLP
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