专利名称：RESIST COATING DEVICE发明人：TAKAHASHI YASUO申请号：JP19531685申请日：19850904公开号：JPS6254920A公开日：19870310
摘要：PURPOSE:To improve the quality and the yield of a semiconductor device byproviding a raised portion removing mechanism to readily remove the raised portiongenerated by coating resist or the like. CONSTITUTION:A coating liquid nozzle 22 fordropping resist or resin is provided above a wafer chuck 20. A raised portion removingmechanism 23 is provided oppositely to the peripheral edge of a wafer 21 secured to thechuck 20 above the chuck 20. The mechanism 23 has a pair of solvent nozzles 24 forinjecting solvent gas of coating liquid or solvent liquid. The nozzles 24 can be adjustableat the inclining angle of the nozzles to a perpendicular plane to the surface of the wafer21.
申请人：TOSHIBA CORP
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