Signal ground planes for tape bonded devices

专利名称：Signal ground planes for tape bonded

devices

发明人：William S. Phy申请号：US06/797283申请日：19851112公开号：US04674808A公开日：19870623

摘要：A multiple layer tape bonding technique interconnects an integrated circuit chiphaving signal and ground bonding pads located thereon to other electrical devices. Thetape bonding structure is comprised of a first layer having electrically isolated individualsignal conductors coupled to respective ones of the signal bonding pads. The individualsignal conductors extend away from the integrated circuit chip in an approximatelyparallel-spaced relationship to one another. An electrically insulating layer having apredefined thickness is deposited atop and adjacent the first layer. A ground plane layeroverlies the insulating layer. The ground plane layer is comprised of a plurality ofindividual ground conductors coupled to respective individual ones of the groundbonding pads of the integrated circuit chip. The individual ground conductors overlie theinsulating layer in a precisely spaced parallel relationship to the corresponding individualsignal conductors. The individual ground conductors can be ieither electricallycommoned, or electrically isolated to allow for individual tapering for impedancematching. The signal and grounding pads on the integrated circuit chip can be positionedrelative to to each other in either a parallel aligned spaced relationship or in alternatingand staggered spaced relationship to each other.

申请人：FAIRCHILD SEMICONDUCTOR CORPORATION

代理人：Stephen J. Phillips,David H. Carroll,James M. Heslin

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